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Filling the Gap: Underfill Materials Dispensing for Electronics
The benefits of capillary flow underfills on solder joint reliability.
Engineering360 News
4 年
Semiconductor Wire and Wedge Bonders Specifications
Thermocompression Ball Bonder Thermocompression uses pressure and temperature to create an intermetallic bond. A “free air ball” is created by a spark from an “electronic flame off” or EFO underneath ...
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